Exploring the Distinctive Traits of Fiber, CO2, and UV Laser Marking Machines

Exploring the Distinctive Traits of Fiber, CO2, and UV Laser Marking Machines

Laser marking machines, crucial in diverse industries, can be categorized into three types based on their light sources: Fiber, CO2, and UV. Let's delve into their fundamental characteristics.

Fiber Laser Marking Machine:

The fiber laser marking machine utilizes a fiber laser to project a beam onto various materials. This alters the material's surface through light energy, creating enduring imprints like patterns, trademarks, and text. Its components include a fiber laser, laser galvanometer, field lens, industrial computer, display, cabinet, control switch, power supply, ruler, and lifting shaft. The MOPA laser marking machine is a subcategory of the fiber laser marking machine.

CO2 Laser Marking Machine:

The CO2 Laser Marking Machine employs a gas laser with an infrared light band of 10.64μm. CO2 gas is introduced into a high-pressure discharge tube, generating glow discharge that releases laser energy. This amplified energy forms a laser beam for material processing, vaporizing the surface to achieve engraving.

UV Laser Marking Machine:

The UV Laser Marking Machine deploys a 355nm UV laser to strike a beam on various substances, breaking the molecular chain through short-wavelength laser action. This method engraves patterns, trademarks, and text, offering permanent markings.

Distinguishing Factors:

  1. Laser Type:

    • Fiber: Utilizes a fiber laser.
    • CO2: Employs a CO2 gas laser.
    • UV: Utilizes a short-wavelength ultraviolet laser.
  2. Laser Wavelength:

    • Fiber: 1064nm.
    • CO2: 10.64μm.
    • UV: 355nm.
  3. Application Fields:

    • CO2: Ideal for engraving most non-metallic materials and some metal products.
    • Fiber: Suitable for engraving most metal materials and some non-metallic materials.
    • UV: Particularly effective for marking plastics and materials sensitive to heat. Well-suited for applications like marking, micro-perforation, high-speed division of glass materials, and intricate pattern cutting for silicon wafers and packaging materials in the food and pharmaceutical industries.

In summary, these laser marking machines exhibit distinct characteristics, making them suitable for specific applications in a range of industries. Understanding their differences is essential for selecting the most appropriate technology based on the intended use case.

 

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